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C02E.pdf
Sep.25,2013
! Caution
Continued from the preceding page.
4-3. Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused
Table 3
Temperature Preheating Temperature
( Δ T)
Iron Tip
by the large temperature difference occurs internally, and can be
the cause of cracks. Capacitors also tend to be affected by
mechanical and thermal stress depending on the board preheating
Part Number
GJM/GQM/GR3/
of Soldering Differential Atmosphere
Temperature
temperature or the soldering fillet shape, and can be the cause
of cracks. Please refer to "1. PCB Design" or "3. Optimum solder
amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
GRJ/GRM Series
03/15/18/21/31 sizes
GRJ/GRM Series
32/43/55 sizes
GQM Series
350°C max. 150°C min. Δ T V 190°C
280°C max. 150°C min. Δ T V 130°C
Air
Air
1-1. In order to reduce damage to the capacitor, be sure to
preheat the capacitor and the mounting board. Preheat to
the temperature range shown in Table 3. A hot plate, hot
air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool
down repidly.
1-3. Perform the corrections with a soldering iron as quickly
as possible. If the soldering iron is applied too long, there
is a possibility of causing solder leaching on the terminal
electrodes, which will cause deterioration of the adhesive
strength and other problems.
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air
heating by a spot heater heats the overall component and
board, therefore, it tends to lessen the thermal shock. In the
case of a high density mounted board, a spot heater can also
prevent concerns of the soldering iron making direct contact
with the component.
2-1. If the distance from the hot air outlet of the spot heater to
22 size
*Applicable for both Pb-Sn and Lead Free Solder.
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Table 4
the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the
Distance
Hot Air Application angle
5mm or more
45° *Figure 1
conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is
recommended that hot air be applied at the angle shown
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
(1206 (3216 in mm) size or smaller)
Application Time
Less than 30 seconds
(1210 (3225 in mm) size or larger)
[Figure 1]
in Figure 1.
One-hole Nozzle
an Angle of 45°
3. Optimum solder amount when re-working with a soldering iron
3-1. In the case of sizes smaller than 0603, (GJM/GQM/GR3/
GRJ/GRM Series, 03/15/18 sizes), the top of the solder
fillet should be lower than 2 / 3 of the thickness of the
component or 0.5mm, whichever is smaller. In the case
of 0805 and larger sizes, (GJM/GQM/GR3/GRJ/
Solder Amount
in section
GRM Series, 21/22/31/32/43/55 sizes), the top of the
solder fillet should be lower than 2 / 3 of the thickness of
the component. If the solder amount is excessive, the risk
of cracking is higher during board bending or under any
other stressful condition.
Continued on the following page.
147
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GRM43DR61E106MA12L
制造商:Murata Manufacturing Co Ltd 功能描述: 制造商:Murata Manufacturing Co Ltd 功能描述:CAP,CERAMIC CHIP,10UF,25VDC,20%,SMD,1812-CASE
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